TRUMPF Targets Glass-Substrate Bottleneck in Next-Generation AI Chip Packaging With New HiPIMS Coating Technology
The race to build more powerful AI chips has increasingly shifted away from the transistors themselves and toward the packaging that connects them, and German laser and industrial technology company TRUMPF says it has cracked one of the toughest manufacturing problems standing in the way of that next generation of packaging. The company announced this … Read more